WIMA SMD-PEN Capacitors

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SMD Capacitors

Capacitors in PCM 2.5 mm

Capacitors in PCM 5 mm

Film/Foil Capacitors in PCM 7.5 - 15 mm

Metallized Capacitors in PCM 7.5 - 37.5 mm

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Metallized Polyethylene-Naphthalate (PEN)
SMD Film Capacitors with Box Encapsulation

Special Features
Size codes 1812, 2220, 2824, 4030, 5040 and 6054 with PEN and encapsulated Operating temperature up to 125°C Self-healing Suitable for lead-free soldering According to RoHS 2002/95/EC
Typical Applications
For general DC-applications e.g. By-pass Blocking Coupling and decoupling Timing
Construction
Dielectric: Polyethylene-naphthalate (PEN) film. Capacitor electrodes: Vacuum-deposited Internal construction:

Encapsulation: Solvent-resistant, flame-retardent plastic case, UL 94 V-0 Terminations: Tinned plates Marking: Colour: Black.

Electrical Data

Capacitance range:
0.01 µF to 4.7 µF
Rated voltages:
63VDC, 100VDC, 250VDC, 400VDC, 630VDC, 1000VDC
Capacitance tolerances:
±20%, ±10%, (±5% available subject to special enquiry).
Operating temperature range:
-55°C to +125°C
Climatic test category:
55/125/21 according to IEC for size codes 1812 to 2824
55/125/56 according to IEC for size codes 4030 to 6054
Test voltage:
1.6 Ur, 2 sec
Insulation resistance at +20°C:

Voltage derating:
A voltage derating factor of 1.25% per K must be applied from +100°C for DC voltages and from +90°C for AC voltages.
Reliability:
Operational life > 300000 hours
Failure rate < 2 fit (0.5 x Ur and 40°C)

Processing and application:

Graphs:

Comparison of dielectrics:

Ur	Utest	C < 0.33 µF	0.33 µF< C < 6.8 µF
63 VDC 100 VDC	50 V 100 V	>3.75 x 10³ M (mean value: 1x10⁴M)	> 1250 sec (Mx µF) (mean value: 3000 sec)
>250 VDC	100 V	>1 x 10⁴ M (mean value: 5x10⁴M)	> 3000 sec (Mx µF) (mean value: 10000 sec)

Measuring time: 1 min.
Dissipation factors at +20°C: tan

at f	C < 0.1 µF	0.1 µF< C < 1.0 µF	C > 1.0 µF
1 kHz 10 kHz 100 kHz	< 8 x10^-3 < 15 x10^-3 < 30 x10^-3	< 8 x10^-3 < 15 x10^-3 -	< 10 x10^-3 - -

Maximum pulse rise time: for pulses equal to the rated voltage.

Capacitance µF	Pulse rise time V/µsec max.operation/test
Capacitance µF	63VDC	100VDC	250VDC	400VDC	630VDC	1000VDC
0.01 ...0.022 0.033...0.068 0.1...0.22 0.33...0.68 1.0...2.2 3.3...4.7	30/300 20/200 10/100 8/80 3.5/35 3/30	35/350 20/200 10/100 6/60 4/40 3/30	40/400 40/400 12/120 9/90 7/70 -	35/350 21/210 14/140 10/100 - -	40/400 25/250 17/170 - - -	50/500 32/320 - - - -

Dip Solder Test/Processing

Packing

Resistance to soldering heat:
Test Tb in accordance with DIN IEC 60068-2-58/DIN EN 60385-23.
Soldering bath temperature max. 260°C.
Soldering duration max. 5sec.
Change in capacitance C/C<5%.
Soldering process:
Wave soldering and re-flow soldering.

Available taped and reeled in 12mm blister pack.

Detailed taping information:

Example for ordering / Part number:

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