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Construction of Plastic Film Capacitors 
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Continuation . . .

In contrast to this, the contact surfaces of the SMD film capacitors viewed, are carried out in the form of metal plates, which are clipped round the capacitor case. This results in the mechanical decoupling of the active capacitor element. Mechanical stress on the component is largely absorbed by the suspension effect of the metal plates and does not reach the active part of the component.

This configuration therefore promises a very high level of mechanical robustness which has been confirmed in the tests carried out. Even with bendings of up to 5mm, cracks were not detected, neither with nor without pre-aging. The following series of pictures show a WIMA SMD in size code 2220 1.0µF / 63VDC subjected to a bending of D = 0mm / 3mm / 5mm.

Distortion of the metal platess is visible, as is a slight raising from the capacitor case. At the end of the bending process, the tabs go back and lie flat against the case again.

    SMD film capacitor size code 2220 1.0 µF / 63VDC

Picture 5: D = 0.0mm

Picture 6: D = 3.0mm
   
Picture 7: D = 5.0mm
 
 

Very Good Soldering Quality of the Metal Plates Configuration

 

Over and above the good mechanical resistance, the metal plate configuration has a further advantage, namely very good solderability and solderjoint reliability in processing and application.

Regarding the thickness of the layers, the electroplated end contacts of the SMD ceramic capacitors are in the region of < 100mm and spread very widely. The thickness of the layers of the tested ceramic versions were measured at between 15mm and 70mm.

On the basis of the tests carried out, it was established that, in practice, under re-flow soldering conditions, the SMD film capacitors in metal plate configuration which were examined, showed an almost perfect solder quality.

The solderjoint / meniscus of the ceramic versions tends to become a gritty / crystallize surface. To obtain an acceptable soldering quality, the processing temperature in all zones of the reflow equipment had to be increased by 10°C. Even so, the flow quality of the solder paste and the shiny surface was nowhere near as good as in the processing of the WIMA SMD in size code 1812. The following pictures show printed circuit test boards which clearly demonstrate this differing behavior.

   
Picture 8:
Reflow solderability metallized polyester capacitor
SMD size code 1812 0.47µF / 63VDC
Process parameter: 200°C / 150°C / 250°C
0.3m / min
    Picture 9:
Reflow solderability ceramic X7R capacitor
SMD size code 1812 0.47µF / 50VDC
Process parameter: 210°C / 160°C / 260°C
0.3m / min
 
 
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